CDCU2A877: Reliability information of Ball share and Ball pull

Hi Junichi,

I have paged our clock buffer expert. We may need to get in touch with our packaging team for this information.

Best,

Evan Su

Asim -san, Evan -san

Thank you for your supporting and sending information.

I confirmed to customer those information but their required infromation is diffrenet. 

So sorry for my poor request information. 

Them their needed info are 

1. Ball share (JESD22-B117)   -- For PKG of FBGA contact balls (to Electronic substrate). 
2. Ball pull (JESD22-B115)     --  For PKG of FBGA contact balls

They want to confirm that this device did clear above both reliability evaluation result. 

If possible, would please give reliability report as attached on PCN letter.

Or please give advice to get them.

Thanks and best regards,
Junichi .Komura@Ted(Tokyo Electron Device Ltd.)

Hi Junichi-san,

Asim is out of the office for today but will review this by tomorrow. We will have to check with the packaging team again.

Best,

Evan Su

Hi Evan -san, 

Do you have any update for this request? 

We hope answer will be soon.

Thanks and best regards,

Junichi Komura@Ted

Hi Junichi-san,

We are working with our QRE team to see if we can publish this data to qualification memo. We will update you as soon as we have more information. 

Best,

Asim

 Hi Evan -san,

Thanks for your supporting and what status is this?

If there are something plan for this, please give info.

Thanks and best regards,

J.Komura@Ted. 

Hi Junichi-san,

Sorry for the delay, I will check with Asim tomorrow to see if the QRE team has responded.

Best,

Evan Su

Asim-san,

Thank you for your supporting.

 I see, no issue reliability reports which is included those.

Then, could you please send TI's confirmation information (ball shear and ball pull measurement results) as the result of passing those test?

We need such info to close customer request.

Thanks and best regards,

J.Komura.

Asim-san,

Thanks for your replay but sorry your shared data are different.

 (Request info are BGA solder ball reliability info. Not intenal wire bonding info.)

Customer request info are as below.
1. Solder Ball Share (Pls see spec of JESD22-B117) for NFBGA(NMK) PKG

   Item: TI spec and test result.

Simple information of this test are as below.
www.xyztec.com/.../

2. Solder Ball Pull (Pls see spec of JESD22-B115) for NFBGA(NMK) PKG

 TI spec and test result. 
Simple info of this test are as below.(below is sample of CSP, test is same as BGA)
www.xyztec.com/.../

So would you please help to get them.

Thanks and best regards,
J.Komura.

Hi Junichi-san,

Thanks for the clarification. Asim will get back to you after the July 4th holiday.

Best,

Evan Su

Evan-san, Asim-san,

Thanks for your supporting.

Then do you have any update info for our customer questions?

Or please give advice.

Thanks and best regards,

J.Komura.

Hi Junichi-san,

I have contacted the product team for bond pull data. I was only able to find ball shear data. It has passed all the reliability test results for ball shear.

Best,

Asim

Asim -san,

Thank you for your supporting and update info.

So is it possible to send us data of test result of ball shear as shear force with TI spec(judge values, min?)?

And also we hope to get ball pull result soon.

Thanks and best regards,

J.Komura.

Hi Junichi-san,

Below is the data for solder ball shear. I have already reached out to packaging team to help find the solder ball pull data. I will update here once I have any info on it. I apologize for the delay on this because this is an old device that was inherited from a different product line and finding data needs some digging.

Solder ball shear:

Best,

Asim

Asim-san,

Thank you very much for sending info of Ball shear and update status.
And we're looking forword for Ball Pull data.

Thanks again and best regards,

J.Komura.

Hi Junichi-san,

I will update when I hear back from our team.

Best,

Asim

Asim-san, 

Thanks for your supporting.

We'd like to know any update due to respond our customer.

or please give advice?

Thanks and best regards,

J.Komura.

Asim-san, 

Thanks for update information.

So due to explain customer, please advice for JEDEC recomendeation as below.

"According to P5&7 on JESD22-B115 doc, 

P5 Scope:

"Depending on test sample configuration, application and purpose of the test (characterization, qualification, production, etc.), other solder joint integrity assessment methods such as JEDEC Solder Ball Shear Test Method JESD22-B117, may be more appropriate. "

P7 Solder Ball Composition 

"  Some solder ball materials may not be suitable for testing due to excess deformation or damage during the
clamping and pulling operations, e.g., elastomer-core solder balls, etc.

By abave information are TI desision to not collect data, it it correct?

Thanks and bext regards,

J.Komura.

Hi Junichi-san,,

I have not confirmed that. I will get more details from packaging team to conform if considers these excerpts and do not collect data.

Best,

Asim

Asim-san, 

Thanks for your supporting. 

Do you get any comments from packaging team?

Or, if "sentence from  P5&7 on JESD22-B115 doc" I pointed out is not wrong, can I answer as TI judgment close to it?

Thanks and best regards,

J.Komura.