Figure c-4. is power leyer of LMX 2594 EVl board and while figure 8.4 is power layer of LMX2615 EVL board. any reason why copper pattern in not there where RF out put is taken in LMX 2594 EVL board.
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Figure c-4. is power leyer of LMX 2594 EVl board and while figure 8.4 is power layer of LMX2615 EVL board. any reason why copper pattern in not there where RF out put is taken in LMX 2594 EVL board.
Hi Nilesh,
We will look into this tomorrow.
Regards,
Vicente
Hi Nilesh,
The engineer who created this design is currently out. After reviewing the power planes with a colleague we suspect the reason why copper was removed under RF out on LMX2594EVM is due to potential coupling between the power planes and the GND vias around RFOUT.
Regards,
Vicente