Part Number: LMK04832
We are using LMK04832 In our design.Input clock is 100MHZ.We need 11 Nos of 40MHZ LVDS clocks.
The system configuration is derived from TICSPro using frequency planner.After programming we are
getting the clock outputs.But the heat on the chip is arounf 71'C when measured through thermal imager
under room temperature TA = 24'C.
The TICSPro shows 2.785 Watts .For Rtheta JA (Junction-to-ambient thermal resistance) given in datasheet 24.3 'C/W
the temperature comes around 2.785 x 24.3 = 67.67 'C .Our system needs to work at ambient temperature of 70'C.
So the junction temperature will cross 125'C.
Is there any issue with the configuration or how to reduce the power and thermal heat?
Attached Configuration file and schematics.



