Regarding PCN PCN# 20240221002.1....For this PCN which is for both a fab change and assembly site change, IBM has questions regarding the package rel data. We have qualified the HFTF facility for TSSOP package for TI, but we need additional information to determine if any of those past quals cover this material set.
IBM requests that TI please provide the following information regarding TI PCN # 20240221002.1:
- Please provide the manufacturer and product name for mount compound A-18 used by HFTF (Group 2).
- Please provide the manufacturer and product name for mold compound R-30 used by HFTF (Group 2).
- Please confirm if the bond wire used by HFTF is palladium coated copper wire (Group 2).
