We are using the 5962R1723601VXC (LMX2615-SP) in our design were looking for assembly guidelines.
We assume the part should be lead formed, but it also has a heat sink pad which needs to be thermally and (maybe) electrically connected to the board.
The issue is the flat leads and heat sink pads are already almost in plane, so there isn't much height to form the leads. It's also difficult to get them completely in plane after forming.
Also do you recommend soldering the heat sink pad, or only using thermally conductive adhesive ? Any concerns with residual stress from soldering the heat sink pad ?
Any recommendation would be appreciated.
