Other Parts Discussed in Thread: NE555,
Tool/software:
Hi team,
On Revision C D/S, I saw below table. Is this typo?
Best Regards,
Shoji
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Hi Shoji-san,
Thanks for the comments.
I think that drawing is correct. I suspect that the package type has typo, SOIC-8 should have dimension 4.90mm x3.90mm typically.
The image below is from NE555.
If the package specification is correct, then the drawing should be correct. The Package size is likely a typo. Let me check with the system engineers.
Best,
Raymond
Hi Raymond,
Thank you for your confirmation. I'll close this thread. Let me know if you have any update.
Best Regards,
Shoji
Hi Shoji,
The TLC555-Q1's package size includes pins as well, which is different from the previous dimension specification, which refers to body size. So there is no typo here.
Best.
Raymond
Hi Raymond,
Do you mean that these values are shown as typical value?
Best Regards,
Shoji
hi Shoji,
Yes, you can consider these figures as min and max dimension, and the package information as nominal or typical.
If you have other questions, please let me know.
Best,
Raymond
Hi Raymond,
Great. Very clear! Thank you for your confirmation.
Best Regards,
Shoji