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About the thermal Pad of CDCLVD1204

Jason Gao
Intellectual 720 points
Other Parts Discussed in Thread: CDCLVD1204

Should the thermal pad of clock buffer CDCLVD1204 be connected to GND? Thank you very much.

  • 0
    TI__Expert 5725 points

     

    Yes, it should be connected to ground as per page 10 of the SCAS898A datasheet.

     

    The device package has an exposed pad that provides the primary heat removal path to the printed circuit board

    (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a

    ground plane must be incorporated into the PCB within the footprint of the package. The Thermal Pad must be

    soldered down to ensure adequate heat conduction to of the package.

     

     

  • 0 in reply to mapefer3
    Intellectual 720 points

    Thank you.

    You know that CDCLVD1204 is a LVDS clock buffer, but one receiver of CDCLVD1204 is HCSL receiver.

    Could you please tell me how to connect it to HCSL receiver? Thank you very much.

  • 0 in reply to Jason Gao
    TI__Expert 5725 points

    Hi Jason,

    Sorry for the late reply. Please find attached some examples of interfacing HCSL to LVDS for the CDCLVD1204.

    Best regards,

    MJ7382.HCSLtoLVDS.pdf