LMK04806: function abnormal issue when using extruded top heat dissipation silicone

Gary Zeng

Part Number: LMK04806

Tool/software:

Hi Ti experts,

My customer is using LMK04806 in vector signal generator product.

Now customer met function abnormal issue when using extruded top heat dissipation silicone for heat dissipation.

Though this chip has bottom thermal pad, customer still wants to use top heat dissipation.

1. Do we have guidance for top heat dissipation of this chip?

2. How much pressure can this chip withstand?

0 Michael Srinivasan over 1 year ago

Hi Gary,

I have contacted the necessary packaging engineer, and I will let you know what their response is.

Thanks,

Michael

0 Michael Srinivasan over 1 year ago in reply to Michael Srinivasan

Hi Gary,

Here is what the packaging engineer responded with:

Max load is 200N - standard number we provide for all QFN packages
This has very large variation depending on a lot of factors size, material type and how it is attach.. This needs actual testing.

Thanks,

Michael

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