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TPS59620: Regarding reflow temperatures

Part Number: TPS59620

Tool/software:

Hi,

We are using AIM RMA Solder Paste RMA 258 15R  solder paste. After Reflow, we observed forming the solder balls beneath the components  especially for LCC packages randomly. So, when we communicate the same to AIM, AIM recommended to increase the peak temperature between 225 to 230 Deg C. Hence, you are requested to confirm that, whether the following component of OEM reference can be subjected for peak temp of 225 to 230 Deg C.

Note :  All these components are Non-RoHS and lead finish is hot solder dip.


1. 5962 - 9172501M3A

2. 5962 - 9221503M2A

3. 596 - 9172601M3A

4. 5962 - 9172801Q3A

5. 5962-87549012A

6. 5962 - 7802005M2A

7. 5962 - 7802301Q2A

8. TPS70358MHKH

9. 5962 - 7802005M2A

10. 5962 - 7802301Q2A

11. TPS70358MHKH