Part Number: LMK04714-Q1
Hello,
I am reviewing the LMK04714-Q1 for a use case where the device will not be soldered directly to a PCB. This is not strictly related to clock and timing, but this is the only forum that exists for the LMK04714-Q1.
From the datasheet, it appears that the thermal specifications (e.g., theta-ja) assume standard PCB mounting with the exposed pad soldered to a thermal land.
In our application, the device would instead be placed in a test socket, and the exposed pad would not be connected to a conductive thermal path. The device would be powered (DC biased) for extended durations (24–36 hours), with minimal switching activity.
Do you have any guidance on thermal behavior in this configuration, such as:
- Expected degradation in theta-ja without exposed pad connection
- Any recommendations for thermal management in socketed operation
- Whether operation under these conditions is within reasonable use, assuming junction temperature limits are maintained
Thank you for your time and support!
Best,
Kevin
