This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMK00304 Questions

Hello, my customer has the following questions regarding these parts:

-in the datasheet what is the difference between output vs part to part output skew?

-what is the maximum intra-pair skew on the output of the buffer using LVPECL?

-what is the maximum slew rate on the output of the buffer using LVPECL? (the datasheet does not provide minimum rise and fall times for the LVPECL outputs)

-on the bottom of the chip there is a notch on the thermal relief ground pad, yet on the recommended footprint this notch is missing—which way would you recommended to proceed about the footprint?

  • -in the datasheet what is the difference between output vs part to part output skew?

    Output skew is skew between any two outputs in a single device operating with identical output buffer type and equal loading while operating at the same frequency, supply voltage, and temperature conditions.

    Part-to-part skew is skew between outputs across multiple devices operating with identical output buffer type and equal loading while operating at the same frequency, supply voltage and temperature conditions.

    -what is the maximum intra-pair skew on the output of the buffer using LVPECL?

    I’m a little confused about this question.  Within the LVPECL buffer pair (intra-pair), the differential outputs are 180 degrees out of phase.  Thus the intra-pair skew between rising edges of CLKout and CLKout* will be half the period of the input clock.

    -what is the maximum slew rate on the output of the buffer using LVPECL? (the datasheet does not provide minimum rise and fall times for the LVPECL outputs)

    I don’t have enough data to specify an “official spec” Max slew rate.  How/why is max slew rate important for the customer?  Usually higher slew rate yields better jitter performance.  What clock frequency is the customer interested in using the device?

    -on the bottom of the chip there is a notch on the thermal relief ground pad, yet on the recommended footprint this notch is missing—which way would you recommended to proceed about the footprint?

    We use the recommended land pattern as specified in the datasheet mechanical drawing.  The notch (Pin 1 ID) in the DAP/pad does not require any special consideration or modification in terms of the footprint.

    Regards,
    Alan