Hello, my customer has the following questions regarding these parts:
-in the datasheet what is the difference between output vs part to part output skew?
-what is the maximum intra-pair skew on the output of the buffer using LVPECL?
-what is the maximum slew rate on the output of the buffer using LVPECL? (the datasheet does not provide minimum rise and fall times for the LVPECL outputs)
-on the bottom of the chip there is a notch on the thermal relief ground pad, yet on the recommended footprint this notch is missing—which way would you recommended to proceed about the footprint?