This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMK00101 EMI issue

Greetings E2E.

my customer is designing with the LMK00101SQE on a RF backhaul design. They tested their design in the lab and it has enormous EMI spurs all the way up to 1Ghz and there is no way at all that it would be FCC compliant. The board is becoming very hot.

Please find attached a screen capture of their design. Please review and advise on your feedback .

  • This question is being addressed in a separate E2E thread (posted by TIer ).  

    Here was the response given there:

    Did they follow the thermal land pattern with multiple thermal vias to the ground layers to help with heat dissipation? How many PCB ground layers did they use? 

    The LVCMOS driver output edge rate is very fast, so the output spectrum will have many harmonics out to GHz range.

    Is the single-ended input swing limited to 2 Vpp max? If not, they may need a voltage divider network on the clock input.

    Note that we will prioritize the response on the other E2E thread.

    Alan