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Heat dissipation Vs Power consumption of CDCM7005RGZT

suehyun lee
Prodigy 40 points


hi,

I want to use CDCM7005RGZT in my design.

In thermal analysis, what will be the heat dissipation of CDCM7005RGZT, if power consumption of it is about 1W.

Some people say that in case of digital IC, heat dissipation is almost same as power consumption and

some others say about 50% of power consumption will be dissipated as heat. which one is right?

Thanks in advance

Regards

  • 0
    TI__Mastermind 22825 points

    Hello,

    I am not entirely sure I understand the distinction you draw between the Power dissipation and Heat dissipation. I have always used these interchangeably as I believe any power dissipation will be in the form of heat that needs to escape the die.

    For thermal analysis, use the total device power dissipation (PD, 1W in your case), along with Theta-jc for your package type (29.9 deg. C/W for the RGZ package) to compute the junction temperature:

    Tj= TA + PD (theta_jc)

    Assuming 50 deg. C ambient (TA), your Tj will be at about 80 deg. C (which is in compliance with the 125 deg. C Abs. max rating).

     Note: The package Thermal Pad must be soldered down to the ground plane in order to get the thermal performance that the datasheet numbers predict.

    Hope this answers your question.

    Regards,

    Hooman