• State TI Thinks Resolved
  • Locked Locked
  • Replies 4 replies
  • Answers 2 answers
  • Subscribers 21 subscribers
  • Views 584 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLC555: TLC555QDRQ1 Flow Soldering Support

Shinobu Yata
Prodigy 20 points
Part Number: TLC555


Hi Team,

Customer needs flow soldering for TLC555QDRQ1.

Can you support flow soldering for this device?

Thank you and best regards,

Shinobu Yata

  • 0
    TI__Mastermind 30600 points
    Hi Shinobu-san,

    Reflow soldering on this device is allowed. You can find the solder profile in this document: www.ti.com/.../spraby1.pdf
    The package dimensions are 4mm by 5mm by 1.75mm for a total volume of 35mm^2 which means the maximum temperature will be 260°C.

    I hope that helps,
    Paul
  • 0 in reply to Paul Goedeke
    TI__Mastermind 30600 points
    You will also be able to find more information here:
    www.ti.com/.../snoa550e.pdf

    -Paul
  • 0 in reply to Paul Goedeke
    TI__Prodigy 20 points
    Hi Paul-san,

    I maybe gave you missunderstanding, customer proceed Flow soldering(wave soldering), not reflow.
    Since customer do Flow soldering(wave soldring), they are asking if there is no problem in quality.
    Is this TLC555QDRQ1 qualified for flow soldering(wave soldering)?

    Thank you and best regards,
    Shinobu Yata
  • 0 in reply to Shinobu Yata
    TI__Mastermind 30600 points
    Shinobu-san,

    Apologies for misunderstanding your question. I have asked about the suitability of wave soldering for the TLC555QDRQ1. In general, TI does not have any guidance on using wave soldering for surface mount devices such as this one. Wave soldering is usually used for through-hole components and is not recommended for surface mount because of the additional thermal shock.

    In AN-2029 (linked in my previous post), section 5 provides some information for wave soldering and this document (www.ti.com/.../scea041.pdf) provides some additional information as well. All TI can recommend is to make sure that the customer follows the JEDEC guidlines for temperatures.

    Can I ask why the customer wants to use wave soldering on an SMT device? Reflow is the preferred choice for reliability and low risk.

    Sincerely,
    Paul