LMK04826: Top Heat Sinking

Tim Rude

Prodigy 10 points

Part Number: LMK04826

Can this part receive top heat sinking?

over 8 years ago

0 Alan O over 8 years ago

TI__Mastermind 32575 points

The primary thermal path is through the device's exposed bottom pad. Please see datasheet section 12.1.1 Thermal Management.

Regards,
Alan

0 Alan O over 8 years ago

TI__Mastermind 32575 points

W.r.t. you question: Top heat sinking can be done, but is not as effective for heat dissipation as through the bottom thermal pad and interface to the PCB ground layers through thermal vias.

Alan

Clock & timing

Clock & timing forum

LMK04826: Top Heat Sinking