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CDCLVP111: Thermal design for LQFP package

Hiroshi Katsunaga
Mastermind 6480 points
Part Number: CDCLVP111

Hello,

My customer has a question about CDCLVP111VF.

[Q]

Please tell me how to design the thermal.

Does this package require heatsink at the top ?

Best Regards,

Hiroshi Katsunaga

  • 0
    TI__Mastermind 32575 points

    A heatsink could help, but the question about whether a heatsink is required depends on the chip power dissipation (depends on # loaded LVPECL outputs) and max ambient temperature.  The goal is to keep the die operating junction temperature below the recommended operating condition of 110 degC max (125 degC is Abs Max).  If given the option, the VQFN package would be preferred since it has an exposed thermal pad to help dissipate the heat (better thermal metrics)than the LQFP package.  You may refer to this app note on thermal metrics: 

    Alan

  • 0 in reply to Alan O
    Mastermind 6480 points
    Hi Alan,

    Thank you for your clear comments.
    Your explanation made that clear to me.

    Thank you for your cooperation.

    Best Regards,
    Hiroshi Katsunaga