• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 22 subscribers
  • Views 712 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

CDCLVP111-SP: HFG0036A Package Question

Braedon Salz
Prodigy 30 points

Part Number: CDCLVP111-SP

Hi there,

The CDCLVP111-SP uses a HFG0036A package. Looking at the datasheet for this package, it mentions a few things in the footnotes:

2. This drawing is subject to change without notice.
3. This package is hermetically sealed with a metal lid.
4. The lid and the heat sink are connected to ground leads.

I am unsure what these mean in terms of the CAD PCB Footprint. For reference, I am assuming the pin leads come out of the "bottom" of the package. Specifically:

  • Is the entire package conductive grounded, or just the top (lid and heat sink)?
  • If it is conductive, should I be putting a ground pad on my footprint for this device? 

Thanks,

Brady 

  • 0
    TI__Genius 14540 points
    Hi Brady,
    -"I am assuming the pin leads come out of the "bottom" of the package"
    [CY] As shown in drawing at end of datasheet, the leads actually leave the package from the top. The height from top of package to the PCB allows for forming the leads in such a way to improve BLR (board level reliability).

    -Is the entire package conductive grounded, or just the top (lid and heat sink)?
    [CY] This device does not have a heat sink as the graphic in the datasheet does not depict one. The footnote should be updated to clarify.
    Also, the metal lid is connected to the die attach area which makes a thermally conductive connection to the substrate of the die. I measure 0.3 ohms from the metal lid to the VEE of the device.

    -If it is conductive, should I be putting a ground pad on my footprint for this device?
    [CY] As this package does not provide a heat sink, a ground pad under the device is not mandatory. However, if conductive epoxy is used to connect bottom package to a ground pad, it could provide some thermal relief. Unfortunately, theta Jbottom is parameter that TI does not model in the absence of a heat sink in the package.

    Thanks
    Christian