LMX2615-SP: Lead Forming Specification for the LMX2615-SP

Marty rodriguez

Prodigy 20 points

Part Number: LMX2615-SP

Lead Forming Specification for the LMX2615-SP

Can you please provide a lead forming spec to match the recommended pad layout.

Thanks in advance,

over 6 years ago

0 Shawn Han over 6 years ago

TI__Genius 9920 points

See Figure 81 "Package Mechanical Information" in datasheet www.ti.com/.../lmx2615-sp.pdf

0 Marty rodriguez over 6 years ago in reply to Shawn Han

Prodigy 20 points

The package dimensions provided in figure 81 does not appear to match the board layout in figure 80. If I try to place the part as supplied I believe the leads would be to long and would need to be trimmed to fit the pads.
Fig. 80 the pad lay out tip to tip is 16.50mm
Fig.81 the leads tip to tip is 19.01 mm
Please advise?

0 Dean Banerjee over 6 years ago in reply to Marty rodriguez

TI__Mastermind 27881 points

Hermetic Package Lead-Forming and Solder Reflow Profiles.pdf LMX2615W PCB Details.pdfMarty,

TI does not do custom lead bending and the default way the leads come make it such that the heat sink is not flush with the board. See these attached references for more details.

Regards,

Dean

0 Dean Banerjee over 6 years ago in reply to Dean Banerjee

TI__Mastermind 27881 points

LMX2615 Soldering and Lead Forming.pdfOne more ..

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LMX2615-SP: Lead Forming Specification for the LMX2615-SP