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LMX2615-SP: Thermal Resistance values

Part Number: LMX2615-SP

On the datasheet for LMX2615-SP it lists the following thermal resistance values: ΘJC(top) = 7.3 °C/W, ΘJB = 7.6 °C/W, and ΘJC (bottom) = 1.0 °C/W. It appears the component is designed for the optimal heat path to be through the bottom, where a heat-sink will be soldered to the board. If that is the case, then why is the ΘJB (junction-to-board thermal resistance) 7.6 °C/W? With a component that is soldered to the board, I don't understand why this value is higher than the junction-to-top thermal resistance. How exactly is the thermal resistance from bottom of case-to-board being calculated for it to have this value, is the soldered heat sink not being considered?