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LMX2615-SP: Soldering & Mounting

Shinu.V.Mathew
Genius 10150 points
Part Number: LMX2615-SP

Hi Team,

My customer is having below query on device mounting,

Is DAM n FILL (done for more than 32 pin IC ) is required? Attached is the DAM & FILL reference shared by customer. This is used for high pin count parts to protect from vibration and to avoid direct contacts. DAM is done with SCOTCH-WELD 2216 and fill is with transparent material DC93500, can this material create any impact on LMX2615 performance? 

Please find the attached addition info.

dam SCOTCH-WELD2216.pdf

Fill DC93500.pdf

Thanks in advance for the help and support.

Regards, Shinu Mathew. 

  • 0
    TI__Guru** 106720 points

    Hi Shinu,

    Our colleague is still OOO, will get back to you once he is back.

  • 0 in reply to Noel Fung
    TI__Genius 12705 points

    Hello,

    Whether DAM and FILL is required is application dependent and not topic that can be answered by TI.    Depending on the application conditions and system use case HW designer will need to determine if the environmental stresses will affect the board level reliability.

    It is possible the epoxy could result in parasitic loading of the RF pins affecting higher operational frequencies. TI does not perform any verification/Validation of RF leakage or loading as a result of epoxy dielectric fill.

    It is recommended that the device DAP provide solid heat transfer to the PCB since the silicon could produce ambient heat dissipation issues.

    Regards,

  • 0 in reply to Liam Keese
    TI__Genius 10150 points

    Hi Liam,

    Thanks for the inputs, will update customer accordingly.

    Regards, Shinu Mathew.