DAC5688: theta jc top resistance

Hi Jonathan,

We will need to look for packaging team to help/confirm this. We will update you

Hi Jonathan,

I had dug up a message from former packaging engineer working on this project before. Please see the following while we check with the packaging team on the thermal:

~~~~~~~~~~~~~~~~~~~~~~~~~~~ (from Gerry Balanon)~~~~~~~~~~~~~~~~~~~~~~~~~~~~

 We have seen customer placing external heat sink on top of the QFN packages using a thermal interface material. Key considerations doing this are as follows.

• Thermal conductivity of the thermal interface material
• Heat sink mounting to the PCB board – make sure that this is not putting a lot of pressure on the TI part since this can impact the package performance/integrity

  If the customer can increase the Cu thickness / % coverage on the PCB board that would be best. Another is if they can move the TI part towards the center of the PCB that can help dissipate heat as compared if this is located on the corner of the board.  

Hi Kang,

Thank you for sharing this information on the thermal conductivity of the thermal interface material. We will be waiting for your update from the packaging team on the thermal.

Best regards,

Jonathan

Hi Jonathan,

the packaging team (Travis Blake) is working on the parameter and will update you sometime next week. Thank you.

-Kang

Hi Jonathan,

I noticed Travis is out of office until the 27th. I will need to ping him again after he returns to office. Thank you.

-Kang

Hi Kang, 

Thank you. We will be waiting for your update. 

Best regards,

Jonathan