ADS54J60: ADS54J60

Hi Roi,

If you haven't already please check with the contract manufacture (CM) to make sure they use an adequate thermal profile on the reflow oven.

There is a large thermal ground pad under the device, which needs to be soldered to ground. If that isn't connected or connected well. This can lead to issues with the device.

Regards,

Rob

Hello

Thanksfor your quick respond.

Attached the X-ray and the thermal profile, could you please check and let me know If the It's ok.

Roi

Roi,

I sent this info to our board shop to get their opinion.

Regards,

Jim

Hi Roi,

The device doesn't look like it has much solder coverage. And are the vias in the ground paddle filled with solder or non-conductive epoxy?

They don't look like it from the xray. Unless you instruct the board house to do so, they won't. This is an extra step in the process and costs $.

Thanks,

Rob