This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Can you please tell me what is the acceptable percentage of solder voiding for the center ground/thermal pad on this device.
Hi Jerry
Thermal vias in the pad area should be filled and un-masked to minimize voiding.
Overall void percentage should be less than 50% of the device thermal pad area.
Best regards,
Jim B