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ADC08D1020: SOLDER VOIDING

JERRY VAUGHN
Prodigy 10 points
Part Number: ADC08D1020

Can you please tell me what is the acceptable percentage of solder voiding for the center ground/thermal pad on this device.

  • 0
    TI__Guru* 91947 points

    Jerry,

    The soldermask clearance needs to be larger than the pad on the board, as a general rule of thumb. 110% would make the clearance a little larger.

     

    Regards,

     

    Jim

  • 0 in reply to jim s
    TI__Mastermind 44570 points

    Hi Jerry

    Thermal vias in the pad area should be filled and un-masked to minimize voiding.

    Overall void percentage should be less than 50% of the device thermal pad area.

    Best regards,

    Jim B