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ADC08D1500: backward compatability

Mete Yasan
Intellectual 500 points
Part Number: ADC08D1500
Other Parts Discussed in Thread: ADC08D1520

Hi all,

I just wonder if ADC08D1500CIYB and ADC08D1500CIYB/NOPB are backward compatible?

I mean, one of is leaded and the NOPB is lead-free packages. so, I just want to know the difference on smd manufacturing process...

regards,

Mete

  • 0
    TI__Mastermind 44290 points

    Hi Mete

    The two devices are identical other than the package solder plating. The package with lead is still available to support certain customers who prefer Pb plating for their application.

    All other customers would be using the CU SN plated /NOPB version.

    There is also the newer ADC08D1520 device that has a very similar pinout can provides improved performance and features compared to the ADC08D1500. It is possible to design a product which can use either device.

    Best regards,

    Jim B

  • 0 in reply to Jim Brinkhurst1
    Intellectual 500 points

    Hi Jim,

    It is not a new design. 

    The price of the leaded and lead-free packages of ADC08D1500 are different. lead free package is cheaper, that's why the customer is interested in this option. 

    But, the current solder flow is for leaded parts. So, could you please advise if leaded part and lead-free part is compatible regarding solerding and manufacturing manner?

    Thanks and best regards,

    Mete

  • 0 in reply to Mete Yasan
    TI__Mastermind 44290 points

    Hi Mete

    It will be OK to use a Pb (lead) soldering process on the lead-free HLQFP package. Since the RoHS compliant part uses CuSn (copper tin) plated leads, there will be some amount of CuSn material in the ADC connections of the resulting assembled board and on the portions of the leads that do not flow during assembly.

    It is up to your customer to decide if they have any concerns about this CuSn material in their finished assembly.

    Best regards,

    Jim B