Other Parts Discussed in Thread: ADS1115, ADS8865,
Hi,
I'd like to get thermal resistance data of this part like below.
I can't find this data on data sheet and web-site.
Pls, could you send it ASAP?
Best regards,
Michael
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Michael,
I don't think that we've ever done the thermal resistance calculation for this device. To get the information, I'll need to request it from the modelling group. This may take a week or two to get the information.
Which package do you need the thermal information for? The MSOP-10 or the SON-10?
Joseph Wu
Michael,
I've put in the thermal modelling request for both packages. When I hear back from them, I'll post back with the results.
Until then, would an approximate value for the thermal resistances be ok? That's something that we support now.
Joseph Wu
Hi Joseph,
Thanks for your kind support.
Could you send approximate value at first?
If you get final data, pls share it ASAP.
Best regards,
Michael
Michael,
I would use numbers like I found in the ADS8865. This has the same basic packages as the ADS1115 (DGS and DRC). These are the values listed:
There will be some variation depending on size of the die, the exact leadframe, and typical power dissipation of the device. However, the ADS1115 has a typical power dissipation below 1mW, so the die temperature will be very similar to ambient.
Joseph Wu
Michael,
The thermal information for the ADS1112 DGS package came through and here are the results:
Theta JA-High K - 175.9
Theta JC, top - 67.4
Theta JB - 98.1
Psi JT - 11.7
Psi JB - 96.3
Theta JC, bottom - n/a
I'm still waiting for the ADS1112 DRC package results. I'll let you know when they are posted.
Joseph Wu