Hi TI,
I found the figures below in this thread: https://e2e.ti.com/support/legacy_forums/hirel/f/space-high-reliability-forum-read-only/719646/tlk2711-sp-request-the-layout-lead-forming-data
The question I have is: Why is there a gap/distance shown beween the bottom of the device and the bottom of the leads, indicated by symbol "A"? As the device has a thermal pad, I would expect "A" to be zero. Is this gap required to account for the solder paste thickness?
Many thanks and best regards,
Jeroen