DP83848I: Package compatibility: LQFP (48) for DP83848I vs HLQFP (48) for DP83848VYB / DP83848-EP?

AnBer

Part Number: DP83848I
Other Parts Discussed in Thread: DP83848VYB, DP83848-EP

Team,
We are trying to understand if in an existing PCB design made originally for DP83848I LQFP (PT-48) the IC can be replaced by DP83848VYB HLQFP (PTB-48) / DP83848-EP HLQFP (PTB-48) without any PCB change.

Looking at the DP83848I datasheet - SNLS266E and DP83848-EP-SLLSEC6E both HLQFP (48) vs LQFP (48) packages seems to have the same mechanical dimension.
Key differences are:
-additional powerpad on HLQFP
-different Lead finish/ball material (SN vs SN | NIPDAU vs NIPDAUAG).

Question:
-For a PCB design original made for DP83848I LQFP (48) can a DP83848VYB HLQFP (48) / DP83848-EP HLQFP (48) be used instead?
I understand that the soldering requirement might be different due to the different ball material, but I am here asking about the compatibility of the electrical specs and of the solder mask (without the powerpad area)?
-Could the powerpad be remained unsoldered?
Or is is a requirement to have it soldered even if the DP83848VYB / DP83848-EP operates only in the -40/+85C range like for DP83848I ?

Thanks in advance,

over 1 year ago

0 James Lee over 1 year ago

TI__Intellectual 2260 points

AnBer,

Thanks for reaching out! I will discuss with our Applications team and get back to you with a solution as soon as possible.

Sincerely,

Jason Lee

+1 James Lee over 1 year ago

TI__Intellectual 2260 points

AnBer,

I just confirmed that these are interchangeable without any PCB change. Hope you have a great rest of your day!

Sincerely,

Jason Lee

0 Ty Pangburn over 1 year ago

Prodigy 50 points

I have a related question to this same issue. So, can we expect the thermal performance of the YYB or EP part to be comparable to the Industrial grade as he asked if the pad isn't soldered? We were also worried about vias next to the thermal pad so one thought was to put some thermal epoxy underneath to act as an insulator and to maybe add a bit of thermal conductivity. I wasn't sure if that was considered in your answer here.

0 James Lee over 1 year ago in reply to Ty Pangburn

TI__Intellectual 2260 points

No, the thermal performance of VYB, EP, and I devices will differ. For more specific details, please refer to this application note:

https://www.ti.com/lit/an/sloa122/sloa122.pdf?ts=1669757205753&ref_url=https%253A%252F%252Fwww.google.com%252F

Also, here are the Thermal Information tables from the respective datasheets:

0 Ty Pangburn over 1 year ago in reply to James Lee

Prodigy 50 points

Not sure if I was following right but I did find some other posts as well as this one. So far what I have seen is that you can exchange the Industrial part with the VYB, or EP and leave the thermal pad floating as long as you stay within the Industrial temperature range. Is that not the case? I do realize that the VYB and EP have different thermal characteristics, but that wasn't really what I was trying to get at. I mainly just need a replacement for the industrial part that isn't available, and our order keeps getting pushed out.

0 Ty Pangburn over 1 year ago in reply to Ty Pangburn

Prodigy 50 points

This is another thread regarding this thread. DP83848VYB: 【ASAP】Difference between DP83848IVV/NOPB and DP83848VYB/NOPB - Interface forum - Interface - TI E2E support forums. Granted they don't discuss the -EP part.

0 James Lee over 1 year ago in reply to Ty Pangburn

TI__Intellectual 2260 points

Ty,

Thank you for clarifying! To answer your question and reaffirm previous threads, as long as your application stays within the temperature rating of the DP83848I, then leaving the thermal pad of the DP83848VYB/-EP floating should be fine.

Sincerely,

Jason Lee