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Hi Team,
Could you please advise if we could place VIA for VDD33 and VDD18 just under the PIN? Or it is recommended to place a short trace to avoid the ball overlapping with VIA?
From DS, seems like VIA just be placed under the PIN. No concern for SMT? Thanks.
Best regards,
Terry
Hi Terry,
It should not be an issue to place the via under the pin. The TUSB2E11EVM has the via directly under the pin.
Regards,
Nicholaus
