SN65LVDS108: Thermal resistance, junction-to-case and/or junction-to-board?

Joshua Aviles

Part Number: SN65LVDS108

Tool/software:

Hello,

The spec available online only specifies the junction-to-ambient thermal resistance by having it be the inverse of a "derating factor" of 10.2 mW/degC. Is there any other information that the TI team could specify concerning the thermal resistance specs for this part?

Thanks,

4 months ago

0 Amy 4 months ago

TI__Genius 14111 points

Hi Joshua,

I will put in a request to our database to see if we can provide more information.

This may take up to two weeks. Thank you for your patience.

Sincerely, Amy

0 Amy 4 months ago

TI__Genius 14111 points

Hi Joshua,

Thank you for your patience on this. Below are the device thermal details.

Additionally, the maximum junction temperature can be estimated by the equation:

Tjmax= TAmax + (Pd x θJA), where TA is the operating free-air temperature and Pd is the power dissipation.

Regards, Amy

Theta JA-High K	67.2
Theta JC, top	17.8
Theta JB	28.2
Psi JT	0.8
Psi JB	27.9
Theta JC, bottom	n/a

0 Joshua Aviles 4 months ago

Prodigy 20 points

Ok, based on the TAmax of 85C and the maximum dissipation of 0.644W (644 mW), here's my calculation for Tjmax = 85 + 0.644*(1/10.2/1000) ~= 148C.

Does this look correct?