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DS125BR401: DS125BR401SQE schematic and layout review request

Cickey Xu
Intellectual 686 points
Part Number: DS125BR401
Other Parts Discussed in Thread: DS250DF810,

Tool/software:

Dear TI Support Team,

could you help review the DS125BR401SQE and DS250DF810 schematic and layout ,the document as attachment.thanksU1&U19.pdfU1U19.zip

  • 0
    TI__Mastermind 23905 points

    Hi Cickey,

    I can review the schematic and share feedback by end of this week. I can review the layout and share feedback by end of next week, 6/28.

    Can you share the name of the customer for my information? If you wish to keep customer name private, you can share with me via E2E private message.

    Best,

    Lucas

  • 0 in reply to Lucas Wolter
    TI__Mastermind 23905 points

    Hi Cickey,

    Here is my feedback on the schematic. I only reviewed networks directly connected to U1 and U19. Note that the customer is still responsible for ensuring their design will operate as intended.

    U1_DS125BR401_Schem_Review.pdf

    U19_DS250DF810_Schem_Review.pdf

    Some general comments I have:

    • I see there is an EEPROM connected to SDA/SDC of U19, however the retimer is configured for SMBus slave mode. This means the EEPROM will not be used to configure the retimer.
    • I see nets connected to U19 are labeled with "KR". Note that DS250DF810 does not support link training or auto-negotiation protocols.

    Best,

    Lucas

  • 0 in reply to Lucas Wolter
    Intellectual 686 points

    Dear Lucas

    thank for your quick feedback and support;

    the customer is SUMA TECHNOLOGY, TI's KMM,a development enterprise server customer.

  • 0 in reply to Lucas Wolter
    Intellectual 686 points

    Dear Lucas,

    I will send this document to customer for checking and loop customer in the e2e post.if any question,maybe trouble you again.

  • 0 in reply to Cickey Xu
    TI__Mastermind 23905 points

    Hi Cickey,

    Thank you for sharing the customer name and looping them in. I'll hold off on starting layout review until they check over my feedback, as their comments/questions could impact how I'll review the layout.

    Best,

    Lucas

  • 0 in reply to Lucas Wolter
    Intellectual 686 points

    Dear Lucas,

    customer can' register MY.TI account,so they can't reply the post on E2E,i had transfer customer reply in the post.,please refer to the attachment;

    can you share your email address and we can communicate by mail.

    ANSWER.zip

  • 0 in reply to Cickey Xu
    TI__Mastermind 23905 points

    Hi Cickey,

    I'm expected to handle customer support communication through E2E so unfortunately I can't share my email.

    Thank you for sharing customer feedback, I'll work on reviewing the layout.

    Best,

    Lucas

  • 0 in reply to Lucas Wolter
    TI__Mastermind 23905 points

    Hi Cickey,

    Can you share the business case of this project?

    Best,

    Lucas

  • 0 in reply to Lucas Wolter
    TI__Mastermind 23905 points

    Hi Cickey,

    Here are my comments on the layout. Note that the customer is still responsible for ensuring their design will work as intended.

    U19 DS250DF810:

    • Make sure high-speed traces maintain 100-ohm differential impedance.
    • The best method to make sure differential impedance is maintained with no discontinuities is via high-speed layout simulation or TDR measurement.
    • High-speed trace length matching looks good.
    • We recommend using smooth curves instead of 135 degree straight edges for high-speed traces when transmission speed is >10G.
    • High-speed traces are consistently surrounded by continuous ground planes 1 layer above and below.
    • I recommend including a ground plane on the same layer as high-speed traces as well to surround traces as a reference.
    • High-speed vias should follow the 10/20/40 rule for drill/pad/anti-pad diameter. My rough measurement showed high-speed vias are 8 mil/18 mil/28 mil.
    • We recommend back-drilling high-speed vias to prevent via stubs.
    • Device ground and power planes look good.

    U1 DS125BR401

    • Make sure high-speed traces maintain 100-ohm differential impedance.
    • The best method to make sure differential impedance is maintained with no discontinuities is via high-speed layout simulation or TDR measurement.
    • High-speed trace length matching looks good.
    • High-speed traces are consistently surrounded by continuous ground planes 1 layer above and below.
    • I recommend including a ground plane on the same layer as high-speed traces as well to surround traces as a reference.
    • High-speed vias should follow the 10/20/40 rule for drill/pad/anti-pad diameter. My rough measurement showed high-speed vias are 8 mil/18 mil/28 mil.
    • We recommend back-drilling high-speed vias to prevent via stubs.
    • Device ground and power planes look good.

    Best,

    Lucas