Other Parts Discussed in Thread: MAX3232E,
Tool/software:
Hi
We have an Integrated circuit failure ,where the IC failure is detected after dipping in Nano coating solutions(Promosolv UT 10) , the PCBA which has 28 Integrated circuits from BGA , TSSOP, QFN and many more package IC ,but none of them failed except for the TI part ,
After SMT soldering the PCBA is subjected for ICT testing , and passed PCBA is Dipcoated and after drying its connected the the main power unit and the PCBA is programmed thru USB-RS232 converter , at this stage we notice junk character indicating the IC failure .On replacing the 3232E it works fine
We are aware of the quality aspect of TI and we recognise this and our apprehension of failure is as follows
- UsB-RS232 converter if not compatible or erratic
- ESD during Dip coating and assembly
- Esd or voltage spike during RS232 connecting with laptop usb.
Is it possible to checked the failed part to ascertain the real failure reasons due to these external factor. if you could support we can probably correct our process or tools and continue using TI part , as we didn’t find such issues from alternate make.
Please support
