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AM26LV32E: Test Failures

6379733
Prodigy 10 points

Part Number: AM26LV32E

I have attached a presentation of an issue, this is the 3rd part that we have experienced this problem with test failures

I can see no PCN's where changes have been made to the die, the part number on the die has no reference to the part number as previously shown from decapsulations that we have carried out internally

We would like a definitive response from Ti as to whats changed, is it a anti-counterfeiting solution, or something else

P-MF01-0170 (CA00168760).pptx 

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    TI__Mastermind 26192 points

    Thanks for reaching out with this problem. 

    There was a PCN for this device for a die change in 2023 (linked here). From the top markings, I can see that these devices span before and after this PCN change. Based on your testing, was there an actual communication failure? From your report, it seems that this is just an ICT spec difference. It is expected to see resistance differences during a die change. Pin resistance to GND is not a required spec that we call out in our datasheet. This device also did go through some bus side improvements regarding the failsafe biasing, which is what you are seeing. So that difference is also expected. 

    This resistance difference is a common topic we discuss with other customers due to die changes. The solution is to adjust the ICT resistance range to include this latest generation of specs.