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DS90C032QML: Reports

Genius 5355 points
Part Number: DS90C032QML

Hi Support,

Could you advise the followings for DS90C032QML?

1)    SEE test report

2)    TID test report

3)    Failure rate

4)    Export control classification

5)    ESD and Moisture sensitivity level

6)    Shock and vibration data ( if available)

Thanks.

  • Ikon,
    You will need to go to the correct space grade version product folder. See www.ti.com/.../technicaldocuments
    There are reports to address 1), and 2).

    3) go to the quality tab, you can obtain FIT rates.

    4) You or your end customer can send an email to the address below to obtain the ECCN information. Unfortunately, this information is not disclosed on our website, or through the Customer Support Center. They can use this address for any future ECCN information requests they may require. Please be sure they include all company contact information, receiving company contact information, device information and what the device will be used for in their request.
    gtc_eccn-hts-naftateam@list.ti.com

    5) ESD is published in the datasheet 3.5KV. This is hermetic package, and MSL level is N/A.

    6) I will need our QA to answer this for a specific answer. However, it passes our QML class V screening requirements. I can follow up on this if you would like more specific information.

    If this answers your question, please click "Verify it as the answer"
    Regards,
    Wade
  • Hi Wade,
    Can I check if the QML Q and QML V versions are using the same die ?
    Also, for point (6), do you have the screening document?
    Thanks.
  • They do not use the same die stock.   The QMLV is RHA, and its material is controlled separately from the non-space version.

    The documents located here may answer your questions on the screening.  There is a quality an reliability section for QML and QMLV.

    Regards,

    Wade

  • Hi Wade,

    Can I say that both are built with the same technology, but QML V has more stringent control on the wafer and dies used, while QML Q uses wafer from a separate plant?

    For the documents, are you referring to the “Qualification Summary” from the link provided? I am getting the below notification when I clicked into them: “Qualification summary not available for this part. Please contact the TI customer support for assistance.”

    Thanks.
  • Yes, they both use same process node, but may be processed somewhat differently.  Same design though.

    I see that the Link I posted did not make it.

    I was referring to the generic information on QML/QMLV processing here:

    www.ti.com/.../space.html

    Lot specific screening information is shipped with the material as part of the Certificate of Conformance.

    Regards,

    Wade