Dear TI team:
My customer encountered some problems when testing EMC, please help to analyze:
1, When dp83tc811s-q1 Ethernet chip is linked up with another dp83tc811s-q1 Ethernet chip in CE and RE tests, the test results will be greatly affected, as below:
----EMC RE linkdown
----EMC RE linkup
----EMC CE linkup
From the above figure, it can be seen that in RE test, LinkUp has larger radiation at around 38M and 80M~100M, while in CE test, LinkUp has larger radiation at around 80M~100M..
2, In the radiation interference rejection (RI) test, dp83tc811s-q1 Ethernet chip was connected with another dp83tc811s-q1 Ethernet chip through twisted pair of wires for the packet sending test. The phenomenon of packet sending test failure occurred in the frequency range of 800M~1G and 1.6G ~2G, and returned to normal after the interference was removed.
The dp83tc811s-q1 schematic as below:
Please help to check whether it can be optimized by hardware and software design?
Thanks!
Regard!
Eric Shen