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DP83TC811S-Q1: DP83TC811S-Q1 EMC issue

Part Number: DP83TC811S-Q1

Dear TI team:

    My customer encountered some problems when testing EMC, please help to analyze:

    1, When dp83tc811s-q1 Ethernet chip is linked up with another dp83tc811s-q1 Ethernet chip in CE and RE tests, the test results will be greatly affected, as below:

    ----EMC RE linkdown

     

     ----EMC RE linkup

       

      ----EMC CE linkdown
         

       ----EMC CE linkup

         

          From the above figure, it can be seen that in RE test, LinkUp has larger radiation at around 38M and 80M~100M, while in CE test, LinkUp has larger radiation at around 80M~100M..

        2, In the radiation interference rejection (RI) test, dp83tc811s-q1 Ethernet chip was connected with another dp83tc811s-q1 Ethernet chip through twisted pair of wires for the packet sending test. The phenomenon of packet sending test failure occurred in the frequency range of 800M~1G and 1.6G ~2G, and returned to normal after the interference was removed. 

         The dp83tc811s-q1 schematic as below:

 DP83TC811S-Q1.pdf

   Please help to check whether it can be optimized by hardware and software design?

   Thanks!

Regard!

Eric Shen