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DS80PCI402: Power dissipation and heat generation under stand-by condition

Part Number: DS80PCI402

Hi Team,

My customer is evaluating the DS80PCI402 which is on the PCI Express add-in card. There are Electrical-to-Optical translation module and PCIe Switch IC on the board too. When they measured the case top temperature of DS80PCI402 under VDD=3.3V and Stand-by condition, it was around 80 degC at Ta=25 degC. Because the PCIe add-in card board itself became hot. And there are some communications even if it is stand-by condition.

Q1. Are there any difference of power dissipation between normal communication condition and stand-by condition?

Q2: Are there any difference of heat generation between normal communication condition and stand-by condition?

Please share your experience regarding power dissipation and heat generation of PCI express system.
Thank you.

Best Regards,

Koshi Ninomiya

  • Hello Koshi,

    How do you define standby condition?  You are stating that there is some communication going through the PCIe link even in standby condition?  Please clarify.

    Regards,

    Davor

  • Hi Davor-san,

    They define as follows,
    The standby condition is that link-up was finished between R.C. (Root Complex) and E.P (End Point), and LTSSM is L0 status. There are no data transmitting and receiving between R.C. and E.P.. But there are signals from PCIe Repeater in the property of PCIe.
    The normal communication conditions is that there are data transmitting and receiving between R.C. and E.P..
    Thank you.

    Best Regards,

    Koshi Ninomiya

  • Hello Koshi-san,

    There would not be difference in the DS80PCI402 power consumption nor  heat generation between normal communication conditions and standby conditions.

    Regards,
    Davor