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Original question:

LMH0387: Layout design : Relief under LMH0387

LMH0387: LMH0387

Jorgen Andersson
Prodigy 60 points
Part Number: LMH0387
Other Parts Discussed in Thread: LMH0397,


Our question: The pdf states that no metal / trace  should be under the chip. Does this mean that the ground plane on inner layers and all layers must be open under the chip?

Best regards,

  Kathy Andersson

  • 0
    TI__Guru* 93670 points

    Hi Jorgen,

    On inner layer under the device you can have GND or VCC. I would avoid fast slew rate signals though. I am not sure if you are aware but now there is next generation of the LMH0387 device part number LMH0397. This part is a monolithic device and you would not have this limitation.

    Regards,, Nasser