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Original question:

SN55LVDS31-SP: Junction-to-Case (top) and Junction-to-Board Thermal Resistances

SN55LVDS31-SP: Junction-to-Case (bottom) Thermal Resistance - Thermal Analysis

Steve Moon
Prodigy 40 points
Part Number: SN55LVDS31-SP

For board level thermal analysis, do I have to add the solder layer thermal resistance to Junction-to-Case (Bottom) Thermal resistance, when thermal pad is soldered to PCB?

Thank you.