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what is the difference between the SN74LVC series and the SN74AUP series when it comes to chipset materials and assembly method/materials? Is it based on the same manufacturing process?
Hi, thanks for your prompt reply. Is the material composition (of chip and assembly) the same for both series but only the process technology is different?
The exact composition will depend on the specific device you're interested in. I can't speak for the entire logic family at once (although you will see many similarities from one to another).
