This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
Hi. Staff
I have a question about the PCN of SN74AHC1G14DCKR.
Thermal values have been updated in PCN: 20240922001.0.
What caused this update?
1.Is this due to changes in thermal resistance measurements made by Semiconductor and IC Package Thermal Metrics? (spra953d.pdf)
2.Is this because the new fab & process technology (RFAB, LBC9) and Assembly & BOM option reported in PCN:20230927000.1 has changed?
3.・Others
best regards
cafain
Hi, Staff
What was the underlying reason for updating the thermal resistance?
Please let me confirm some more details.
What was the reason for updating the thermal resistance?
- Was it because the FAB was changed?
- Was it because an assembly site was added?
- Other
regards
cafain
TI plans to completely switch over to the new fab site (and associated assembly sites). The new datasheet is for those new devices.
Hi Cafain,
Clemens is correct, we plan to move this device to a different FAB and A/T sites.
Best,
Malcolm
Hello, I had the same quetsion. Does it mean that there is impact on characteristics by the change reported in PCN 20231219000.1?
The electrical characteristics should remain the same (in regard to what is on the datasheet).
Best,
Malcolm