SN74LVC1G04: PCN# 20251104000.1A

Yuta Nishie

Part Number: SN74LVC1G04

Hi,

I found the following thread regarding the thermal property changes in the datasheet.

https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1600216/faq-the-thermal-information-in-the-datasheet-has-changed-what-does-this-mean-for-me

It says "The materials used, manufacturing process, and device core have not changed, so electrical performance will remain the same," but the Process and Materials are changed for PCN# 20251104000.1A.

Am I correct in understanding that the Min/Max values for electrical properties and temperature ranges are unchanged for PCN# 20251104000.1A?

Best Regards.

Nishie

3 days ago

+1 Malcolm Lyn 2 days ago

TI__Mastermind 29360 points

Hi Nishie,

Yes, that is correct.

Best,

Malcolm

0 Yuta Nishie 1 day ago in reply to Malcolm Lyn

Genius 5390 points

Hi Malcolm-san,

Thank you for your reply.

Junction-to-top characterization value for DCK package has been changed from 2°C/W to 195.6°C/W. I would like to know the reason for the drastic change.

Best Regards,

Nishie

+1 Malcolm Lyn 16 hours ago in reply to Yuta Nishie

TI__Mastermind 29360 points

Hi Nishie,

There are two reasons:

The earlier thermal simulations/characterization process was less accurate than our current one, as noted in the FAQ.
PCN #20251104000.1A = RFAB qualification. This means the die shrunk significantly, which will also correlate with a significantly higher Junction-to-top and other thermal values.

Best,

Malcolm

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SN74LVC1G04: PCN# 20251104000.1A