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SN74LVC1G06: PCN#20251104000.1A

user5040950
Prodigy 10 points

Part Number: SN74LVC1G06

Dear TI Team,

Regarding PCN#20251104000.1A, we have received a notification of a datasheet change.
The affected parts are listed below, and we have noticed that the thermal resistance values have significantly increased:

  • SN74LVC1G06DCKR
  • SN74LVC1G07DCKR
  • SN74LVC1G14DCKR
  • SN74LVC1G17DCKR

We would like to request clarification on the following points:

  1. Reason for Change
    Could you please explain the main factors that led to the significant increase in thermal resistance values?

  2. Impact Assessment Data
    Since the increase rate is substantial, we believe it may affect our products.
    Conducting design condition reviews and requalification tests for all usage locations would be highly impactful.
    Therefore, could you provide any data that would support the assumption that the component characteristics and actual performance remain equivalent before and after the PCN change?

  3. Measurement Data for Current Parts
    Is it possible to prepare measurement results for the current parts (prior to the PCN change) under the same conditions as those applied in the PCN change?

We value TI products and wish to continue using them in our designs.
Your cooperation and support in providing the above information would be greatly appreciated.

Thank you very much for your assistance.

Best regards,
MitsubishiElectric
Kazuhiro Kairada
(Kairada.Kazuhiro@zc.MitsubishiElectric.co.jp)

  • 0
    TI__Genius 10340 points

    Hi Kazuhiro Kairada,

    Please take a look at  [FAQ] The thermal information in the datasheet has changed! What does this mean for me? This FAQ discusses the changes in the thermal values because we've been updating a lot of thermal information in our datasheets. However, the PCN you are referencing also discusses a new fab site, so I will also address that here.

    1. Reason for Change: There are two reasons. Firstly, we changed the way we model our thermal resistance values. The new method is significantly more accurate. This in itself does not represent a major device change. However, the PCN you are referring to also involves a change to a new manufacturing site, so there will be some differences in manufacturing. The die changed, so that can also change the thermal resistance values. 

    2. Impact Assessment Data: The risk due to the thermal changes is low. The only part of the datasheet that has changed is the thermal values, so if your system is designed within the other datasheet specifications, there should be no issues. However, there will be some minor differences in manufacturing because this PCN references that the device is going to be made in an entirely different fabrication site. We can provide samples so that you can evaluate the acceptability of the changes, but there is no reason to believe that there will be any impact on your system.

    3. Measurement Data for Current Parts: As you've noted, the change is multi-faceted. I can assure you that the current numbers are very accurate and that these are the numbers you should be using. That said, the thermal performance of the device is heavily influenced by the system as a whole. The App Note Semiconductor and IC Package Thermal Metrics is a good reference. I encourage you to request samples from the PCN team or from your field team to evaluate these changes in your system.

    Regards,

    Nikki