Part Number: SN74LVC1G08
20260915000.1.pdf 20260915001.2.pdf 20260915000.2.pdf
Hello,
We are reviewing the following three PCNs regarding the qualification of RFAB as an additional Fab site option (die shrink from FFAB 200mm to RFAB 300mm), along with associated die revision, datasheet, and assembly/test site updates:
- PCN #20260915000.1 – covering SN74LVC1G125DCKR, SN74LVC1G32DCKR (among other devices)
- PCN #20260915000.2 – covering SN74LVC1G08IDCKRQ1 (among other devices)
- PCN #20260915001.2 – covering SN74LVC1G08QDBVRQ1 (among other devices)
All three PCNs are part of Kinova's approved vendor list. Each notice states that "physical aspects of the device have changed" and that "there are changes in the electrical tables," recommending that the Supporting Data Packet (SDP) be requested for further details and that sample evaluation is encouraged.
Could you please provide the SDPs for all three PCNs, specifically covering:
- The die shrink details and resulting changes to electrical characteristics (we note the published datasheet revisions already show significant increases in junction-to-ambient thermal resistance values for the DCK, DBV, and DRL packages)
- Any changes to package dimensions or land pattern compatibility
- Confirmation of Form, Fit, and Function equivalence, or details of any deviation
We would also like to request evaluation samples for the affected devices ahead of the sample request deadlines noted in each PCN, in order to complete our internal qualification review before the estimated first ship dates.
Thank you in advance for your assistance.
