SN74LVC1G08: Thermal Data for DSF Package

Jerry Wright

Part Number: SN74LVC1G08

We're using the DSF package of the subject part. The datasheet does not provide the thermal data for this package. Please provide the Junction-to-case thermal resistance (θJC), Junction-to-board thermal resistance (θJB), Junction-to-ambient thermal resistance (θJA), maximum junction temperature (Tjmax), and the maximum Themal Design Power (TDP) for this package.

over 6 years ago

0 Emrys Maier over 6 years ago

TI__Guru* 97046 points

Hi Jerry,

I have put in a request for the DSF package thermals -- it typically takes 1 to 2 weeks to get results.

In the meantime, I've always been curious as to why engineers need thermals for logic gates. Do you expect to drive a lot of power through this device?

Also, you might find this FAQ helpful:

0 Jerry Wright over 6 years ago in reply to Emrys Maier

Prodigy 60 points

Thanks for the response.

My reason - I'm a mechanical engineer designing a thermal solution for a new circuit board. In doing so, I need to verify that all parts on the board stay below their maximum junction temperature. To do this, I try to include all active components in my thermal model. Simulating this part may not be necessary; however, I personally don't know until I simulate the part. If the datasheet provided the maximum thermal design power and the junction to ambient thermal resistance, I could potentially disregard; however, it is always safer to simulate.

0 Emrys Maier over 6 years ago in reply to Jerry Wright

TI__Guru* 97046 points

Interesting - thanks for the insight!

0 Emrys Maier over 6 years ago in reply to Emrys Maier

TI__Guru* 97046 points

Hey Jerry,
I'm expecting these results back by February 1. I will get back to you if they come in sooner.

Logic

Logic forum

SN74LVC1G08: Thermal Data for DSF Package