SN74LVC1G08: Thermal Data for DSF Package

Hi Jerry,

I have put in a request for the DSF package thermals -- it typically takes 1 to 2 weeks to get results.

In the meantime, I've always been curious as to why engineers need thermals for logic gates.  Do you expect to drive a lot of power through this device?

Also, you might find this FAQ helpful:

[FAQ] What is the maximum junction temperature (TJMAX) for a device? - Logic forum - Logic - TI E2E support...

e2e.ti.com

FAQ: Logic and Voltage Translation > Power and Thermals >> Current FAQ The vast majority of logic devices do not list a maximum junction temperature ( T J(max

Thanks for the response.

My reason - I'm a mechanical engineer designing a thermal solution for a new circuit board.  In doing so, I need to verify that all parts on the board stay below their maximum junction temperature.  To do this, I try to include all active components in my thermal model.  Simulating this part may not be necessary; however, I personally don't know until I simulate the part.  If the datasheet provided the maximum thermal design power and the junction to ambient thermal resistance, I could potentially disregard; however, it is always safer to simulate.