This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi Team,
My customer got the PCN mentioned that SN74AVC4T234ZSUR will be EOL and recommended SN74AVC4T234ZWAR (new) for it.
From the PCN that mentioned that nFBGA provides the same X and Y dimensions as MicroStar BGA, and provides pin-to-pin and footprint compatibility. However the nFBGA PCB land pattern and stencil recommendations have been updated to achieve better soldering results after extensive testing and evaluation.
Here need your help to provide the PCB land pattern comparison table between SN74AVC4T234ZWAR and SN74AVC4T234ZSUE due to I can't find what the major difference from current datasheet.
Best regards,
Albert Lee.
Hey Albert,
Both land patterns are provided in the data sheet for you to compare. The new NFBGA package is drop in compatible.
Hi Dylan,
Thanks but as I mentioned in past that I can't find any the land pattern deviation between these two from datasheet. Can you help yo point out which deviation items would be? Thanks.
Albert Lee.
Hey Albert,
Why would there be deviations if they are identical packages?
Hi Dylan,
This is what I ask due to I can't find the deviation from the datasheet but there has the statement in PDN description: However the nFBGA PCB land pattern and stencil recommendations have been updated to achieve better soldering results after extensive testing and evaluation.
Customer just wants to make sure it's no any deviation would be. Could you help to check and just confirm this one?
Albert.
Hey Albert,
If the customer already has a land pattern made, the new package will fit. If the customer does not have a land pattern made, they can use the land pattern recommendation in the back of the datasheet.