Tool/software:
Hi TI Experts,
Can you provide a List of collaterals that can be referred when starting a custom board hardware design.
Hi Board designers,
The below links are a quick reference to the collaterals that can be referred when starting a custom design.
Device Selection and features
Product Pages
https://www.ti.com/product/AM2434
https://www.ti.com/product/AM2432
https://www.ti.com/product/AM2431
AM243x Sitara
Microcontrollers datasheet
https://www.ti.com/lit/pdf/sprsp65
Silicon Errata
AM64x/AM243x Processor Silicon Revision 1.0, 2.0
https://www.ti.com/lit/pdf/sprz457
Technical Reference Manual
AM64x /AM243x Processors Technical Reference Manual
https://www.ti.com/lit/pdf/spruim2
Custom Board design:
Hardware Design Considerations
Hardware Design Considerations for Custom Board Using AM6442 , AM6422 , AM6412 and AM2434 Processors
https://www.ti.com/lit/pdf/sprad67
Schematic Design and Review Checklist
AM6442 , AM6422 , AM6412 and AM2434 Processor Schematic Design Guidelines and Schematic Review Checklist
https://www.ti.com/lit/pdf/spracu5
Power Consumption
AM64x Maximum Current Ratings (for reference)
https://www.ti.com/tool/download/SPRR451
AM243x (ALV) Maximum Current Ratings
AM243x (ALX) Maximum Current Ratings
AM64x/AM243x Power Estimation Tool
https://www.ti.com/lit/pdf/spracw6
SoC power solutions Application notes:
Powering the AM64x with the TPS65220 or TPS65219 PMIC
https://www.ti.com/lit/pdf/slvafe9
Evaluation - EVM
EVM for ALV package
TMDS243EVM AM243x evaluation module for Arm® Cortex®-R5F-based MCUs
www.ti.com/.../TMDS243EVM
Design files
TMDS243DC01EVM
AM243x and AM64x evaluation module breakout board for high-speed expansion
www.ti.com/.../TMDS243DC01EVM
www.ti.com/.../sprr443
TMDS64DC01EVM AM64x IO-link and high-speed breakout card
www.ti.com/.../TMDS64DC01EVM
dr-download.ti.com/.../sprr457.zip
Launchpad for ALX package
LP-AM243 AM243x general purpose LaunchPad development kit for Arm®-based MCU
www.ti.com/.../LP-AM243
www.ti.com/.../sprr433
Revision History
AM243x_LP_EVM_Change_List_For_REVE2.xlsx
AM243x_LP_EVM_Change_List_For_REVE3.xlsx
BP-AM2BLDCSERVO
AM2x Brushless-DC (BLDC) Servo Motor BoosterPack
www.ti.com/.../BP-AM2BLDCSERVO
www.ti.com/.../sbar023
BOOSTXL-IOLINKM-8 Eight port IO-Link master BoosterPack
www.ti.com/.../BOOSTXL-IOLINKM-8
Additional files for reference:
TMDS64EVM Design Package Folder and Files List
www.ti.com/.../TMDS64EVM
https://www.ti.com/lit/pdf/sprt782
TMDS64EVM Design File Package
https://www.ti.com/lit/zip/sprr462
SK-AM64B Design Package Folder and Files List
www.ti.com/.../SK-AM64B
https://www.ti.com/lit/pdf/sprt783
SK-AM64B Design File Package
https://www.ti.com/lit/zip/sprr460
Add-on cards
GPMC NAND Expansion Card
HSE NAND EXP BOARD + BREAKOUT BOARD.zip
There seems to be a muxed GPMC interface implemented.
https://media.digikey.com/pdf/Data%20Sheets/Texas%20Instruments%20PDFs/TMDXICE3359_SCH.pdf
PinMux
AM243x (ALV)
AM243x (ALX)
CAD symbols
Cad symbol specific to the selected device can be chosen from the device product page. Refer below example:
https://www.ti.com/product/AM2431#cad-cae-symbols
https://www.ti.com/product/AM6442#cad-cae-symbols
Ordering & quality
https://www.ti.com/product/AM2431#order-quality
https://www.ti.com/product/AM2432#order-quality
https://www.ti.com/product/AM2434#order-quality
Package pad diameter and substrate pad dimension
AM64x -> ALV pkg : ball diameter 0.5mm : substrate pad 0.45mm
The recommendation is 1:1 ratio between PCB pad and substrate pad.
Lead finish/Ball material
SnAgCu
DDR Board Design and Layout Guidelines
AM64x\AM243x DDR Board Design and Layout Guidelines
https://www.ti.com/lit/pdf/spracu1
Escape Routing for PCB Design
AM64x and AM243x BGA Escape Routing
https://www.ti.com/lit/pdf/spruiy5
Design Simulation files
https://www.ti.com/product/AM6442#design-tools-simulation
Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model, power-estimation tool (PET) and Maximum Current Ratings.
IBIS model
Thermal model attached in case the thread is not accessible.
https://www.ti.com/product/AM2434#design-tools-simulation
AM64x:
(23) AM6442: Ansys Compatible Thermal Model - Processors forum - Processors - TI E2E support forums
AM64x PDN Target impedance values:
Impedance target values for VDD_CORE on AM243x
Impedance target values for VDD_CORE on AM64x
Low freq (< 1MHz): 15 mOhm
Mid freq (1 < 20MHz): 35 mOhm
High freq (20 < 50 MHz): 35 mOhm
This is valid for either of the core voltage voltages (0.75V, 0.85V). We do not provide target impedance values for other rails on AM64x.
Note:
We do not include Buck output inductance in PDN simulations.
For VDDS_DDR: we do not recommend using target impedance as the signoff for DDR.
Refer to the AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines which outlines all details of power aware SI/PI simulations
that need to be run. The eye mask checks from these power aware simulations are the signoff.
Power Distribution Networks: Implementation and Analysis
Sitara Processor Power Distribution Networks: Implementation and Analysis
https://www.ti.com/lit/pdf/sprac76
High Speed Board design and Signal integrity simulation
https://www.ti.com/lit/pdf/spraar7
https://www.ti.com/lit/pdf/spracn9
https://www.ti.com/lit/pdf/sprabi1
Technical Documents
Collaterals and application notes
https://www.ti.com/product/AM6442#tech-docs
Technical Support
AM6442, AM6441, AM6422, AM6421, AM6412, AM6411 Custom board design - FAQs
Previous E2E threads - Keywords AM64x, AM644X, AM6442, AM6441, AM6422, AM6421, AM6412, AM6411, AM2431, AM2432, AM2434
Starting a new thread
Useful links
Sitara family of processors FAQ master list
Other FAQs
Notes
Regards,
Sreenivasa
