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TMS320F28035: TMS320F28035 soldering work

Dong Ba
Intellectual 825 points
Part Number: TMS320F28035

datasheet: https://www.ti.com/lit/ds/symlink/tms320f28035.pdf?ts=1612331817809&ref_url=http%253A%252F%252Fdev.ti.com%252Ftirex4-desktop%252Fexplore%252Fnode%253Fnode%253DADWcF1K9obH-WykfrP3jMQ__coGQ502__LATEST%2526search%253D28035

Hi team,

1.The customer has a question about Note F on Page 165 of the datasheet, it is not stated in the datasheet, please provide more details.

2.About stencil thickness for QFP package. We are using 5 mil stencil for screen printing and we found solder short (QFP pack) .When we changed the stencil from 5 to 4 mil no solder short found. As per your recommendation what is the recommended stencil thickness for QFP package.

  • 0
    TI__Mastermind 41805 points

    Ba,

    1. I reviewed all versions of the documentation and there has never been a note "F". I believe this should reference note "D".
      1. I have requested this to be updated.
    2. It is best to contact your manufacturer on what tolerances they need to reliably avoid solder bridges. In our designs we err on the side of a smaller landing pad, but this depend on your manufacturer.

    Regards,
    Cody 

  • 0 in reply to Cody Watkins
    TI__Intellectual 825 points

    Hi Cody, 

    The customer need the updated datasheet, could you please share the schedule and expected date about the process？

    B.R.

    Eric

  • 0 in reply to Dong Ba
    TI__Mastermind 41805 points

    Eric,

    currently it is in our bug tracking system, I do not have a timeline for when this activity would complete.

    Frankly, I don't see why this is relevant for the customer to have a new revision published. The customer is still required to follow all notes in the datasheet, which includes the note "D" wither or not its specifically called out next to the footprint symbol or not.


    Regards,
    Cody