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I need the mechanical data for the MSP430F5528IYFF (MSP430F5528 64 pin DSBGA YFF package). Here's what I see in the data sheet.
When I look for the package drawing that I need at the end of the data sheet, I don't see it. Here is an example of what I need demonstrating a different package I am not interested in.
Please add the equivalent information for the YFF package to the data sheet or in this forum post.
Would it be accurate to take the package drawing from the YFF (R-XBGA-N49) 4207625-16 (Rev. P) and make the following adjustments?
On the product page if you jump to: http://focus.ti.com/docs/prod/folders/print/msp430f5528.html#pricingpackaging
and then click on the Package hyperlink in the box marked "CAD Symbols & Footprints"
Direct link is http://www.ti.com/litv/pdf/mpbg269e
Should just be labelled as "Mechanical Data"
Yes, I see that the package information for the ZQE package is there. I'm not interested in that one. I need the 64 YFF package information.
Hi Jason,
attached please find the package drawing for the YFF package variant. It is somewhat generic in the sense that it doesn't call out the D and E dimensions since they are device (die) dependent. For those measurements refer to the table in the device datasheet (3.76 +/- 0.03mm). Once the device is released to market the package drawing will be added to the datasheet.
Regards,
Andreas
Jason Work said:Here's what I see in the data sheet.
This image above for the MSP430F5528 YFF package (MSP430F5528IYFF) contains incorrect data. It was updated with correct data November 2, 2011.
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