Hello TI,
I've already used the DRV8256PRGER in a design and like it pretty much. Especially the size / power density of this VQFN device is awesome.
To improove the thermal management for my next design, I would like to connect the NC pins (Pins 15, 17, 18) to GND and thereby build a copper connection between the thermal pad of the device (on the top layer) and some surrounding copper. Is this possible (like e.g. for the TPS26632RGE) or ist there some internal connection on these pins?
The picture below tries to illustrate what I want to do:
Best regards,
Markus
