DRV8256: Bake duration & temp for IC’s that have been subject to moisture

SouthernAtHeart

Part Number: DRV8256

I have a dozen or so IC’s I plan to use that are from a previous project, so the have been on the shelf for a year. I see there are different bake profiles on my reflow oven. What temp and how long do you recommend baking these to prep them for the final reflow?

7 months ago

0 SouthernAtHeart 7 months ago

Prodigy 60 points

I’m just baking them at 125°C seems like the normal for MSL3 parts.

0 Jacob Thompson 7 months ago in reply to SouthernAtHeart

TI__Mastermind 21690 points

Hey Charlie,

See the below table from the device datasheet:

It depends on the device package, then I would google "<My reflow oven> MSL level X profile"

Best,

Jacob

0 SouthernAtHeart 7 months ago in reply to Jacob Thompson

Prodigy 60 points

Thanks. Oooked all thru the data sheet for that but didn’t see it. First time for having to bake ICs…. Next time I’ll know where to find it. Thanks.

0 Jacob Thompson 7 months ago in reply to SouthernAtHeart

TI__Mastermind 21690 points

Hey Charlie,

No worries, our datasheets are quite long.

Here's our app report on MSL Ratings and Reflow Profiles. After baking, you have 7 days to use them in reflow soldering before they become sensitive to moisture again.

Best,

Jacob

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DRV8256: Bake duration & temp for IC’s that have been subject to moisture