Hello team, I’ve got a question from the customer, and would like to ask your advice.
Should Thermal pad (for WQFN) and PowerPAD (for HTSSOP) be connected to PGND, independent from GND?
Or can they simply be connected to GND?
The function block diagram (Fig 15) looks like having separate GND and PPAD, but the layout example of HTSSOP seems to have only one GND pour (Fig 67).
Also, the layout example of QFN (Fig 68) has white area under the thermal pad which I assume to be connected to the GND (or PGND)
Best regards,
Kurumi Hasegawa
